Digital
Multi Frequency
Ultrasonic Generator
Model MK II
CUSTOM
DESIGN TRANSDUCER Frequency
from 50 to 140 KHz Fine
wire Bonder Heavy
wire Bonder Heavy
duty flip chip Bonder
APPLICATIONS Fine
wire bonding Heavy
wire bonding Flip
chip die bonding
Model
MK I ( OEM Version) Operating frequency range from 50 to 150 KHz
Output power from 5 to 30W 12 bits digital input Mode: Constant voltage / Constant power RS 232 communication Custom SW communication protocol
*
The specification and appearance may be changed
without notice for the continually improvement
SONICA
PRODUCT LINE
Digital
Multi Frequency 
CUSTOM
DESIGN TRANSDUCER 
Frequency
from 50 to 140 KHz 