H2300 BOND PULL TESTER
Simple design and operation  
Accommodates for TOs, Dips, & flatpacks, etc.
Use in destructive or non-destructive mode
Certified to MIL-STD-833 Method 2011
With one year warranty    

The Model H2300 Bond Pull Tester is designed to test the integrity of bond wires used in many types of electronic package. A tungsten wire hook is used to hook the bond wire. The package is held in place by holder, an adjustable damping device is used to insure a smooth pull. The pull range is 0.3 to 150 grams.
 
   

Ordering Information
Type number Ranges in Grams
H2300-003 0.3-3.0
H2300-006 0.6-6.0
H2300-015 2.0-15.0
H2300-030 3.0-30.0
H2300-050 5.0-50.0
H2300-150 10.0-150.0

* The specification and appearance may be changed without notice for the continually improvement *