THERMALLY CONDUCTIVE
/ ELECTRICALLY INSULATING SERIES
 Epoxy
Technology’s thermally conductive/electrically insulative
epoxy adhesives range from the following :
Rigid to flexible (Ideal for substrates with CTE
mismatches)
High thermal conductivity – Best for heat sinking
Long pot life – Allows for long production runs
Low temperature cure – Best for temperature sensitive
devices
Epoxy Technology’s thermally conductive lines of epoxies are
used extensively for adhesive and potting applications in
many high-tech electronic industries. Whether you need to
remove heat, provide increased dielectric strength, or
protect the circuit from its hostile environments, Epoxy
Technology’s products are unparalleled in their performance.
Representative examples from our extensive offering :
EPO-TEK H70E and EPO-TEK H65-175MP are most common for
bonding IC’s in semiconductor or
hybrid micro-electronic
packaging
EPO-TEK 930-4 has been very useful in heat sinking power
devices such as AC-DC converter modules, while T7109 is
ideal for removing heat from high power LED’s
and laser
diode fiber component packages.
- EPO-TEK T7110 and
EPO-TEK T905BN-3 are favorites for
potting applications providing a robust, thermally enhanced
and protected circuits.
Please click
on Model No. for Detail
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